JPH032671U - - Google Patents
Info
- Publication number
- JPH032671U JPH032671U JP6192589U JP6192589U JPH032671U JP H032671 U JPH032671 U JP H032671U JP 6192589 U JP6192589 U JP 6192589U JP 6192589 U JP6192589 U JP 6192589U JP H032671 U JPH032671 U JP H032671U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- coating material
- soldering
- soldering flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 3
- 230000004907 flux Effects 0.000 claims 2
- 230000000740 bleeding effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6192589U JPH032671U (en]) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6192589U JPH032671U (en]) | 1989-05-30 | 1989-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH032671U true JPH032671U (en]) | 1991-01-11 |
Family
ID=31590614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6192589U Pending JPH032671U (en]) | 1989-05-30 | 1989-05-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH032671U (en]) |
-
1989
- 1989-05-30 JP JP6192589U patent/JPH032671U/ja active Pending